three dimensional integrated circuits

The very large scale monolithic integrated circuits have already reached the limit of integration or miniaturization. If we want to raise its packaging density and expand its function further, developing the three dimensional microwave integrated circuits ( 3DMIC) is the only way.

超大规模单片集成电路已经达到其集成或微型化的极限，要进一步提高其组装密度和扩展功能，唯一的途径就是发展三维微波集成电路（3DMIC）。

In this paper, a new and effective absorbing boundary condition, derived from Z-transform domain and FDTD method are used to analyze three dimensional microwave passive integrated circuits.

本文基于Z-变换域上导出的一种新的有效的吸收边界条件和FDTD法对三维微波无源集成结构进行了全波分析。

Vertical interconnections are typical structures in three dimensional microwave and millimeter wave integrated circuits.

垂直互连是三维微波和毫米波集成电路中的典型结构.